Cutting wheel for semiconductor
Hongtuo, as a major designer, manufacturer and distributor of diamond and CBN grinding wheels, can offer an excellent selection of back grinding wheels. This particular grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used on different grinding machines made in Europe,America,Japan, and China. They also feature a stable performance and a high cost effectiveness.
1. Silicon Wafer Back Grinding Wheel
This abrasive wheel is primarily used for thinning and finishing semiconductor wafers. It comes with a superior grinding performance and a low coast. It can be used on grinding machines manufactured in Japan,Germany and China.
Grinding Objects: Discrete devices, IC substrate silicon wafers and original silicon wafers
Work Piece Materials: Monocrystalline silicon and other semiconductor materials
Processes: Back to front rough and fine grinding
2. LED Substrate Back Grinding Wheels
This variety of cup grinding wheel is mainly used in the LED industry for back grinding of sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers. It works well with European, American, Japanese and Chinese grinding machines with an excellent performance and cost effectiveness.
Grinding Objects: Sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers
Work Piece Materials: Synthetic sapphire, monocrystalline silicon, gallium arsenide and gallium nitride
