Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

Zhengzhou Hongtuo Superabrasive Products Co., Ltd. To be the Top-tip superabrasive products supplier

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High End Wafer Dicing Saw Gallium Phosphide With Adjustable Blade Strength

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Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
City:zhengzhou
Province/State:henan
Country/Region:china
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High End Wafer Dicing Saw Gallium Phosphide With Adjustable Blade Strength

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Brand Name :HT
Model Number :HT-YB
Certification :ISO9001:2015
Place of Origin :China
MOQ :2
Price :price negotiable
Payment Terms :T/C,T/T
Supply Ability :300/pcs per month
Delivery Time :2-3weeks
Packaging Details :Carton Box
Product Name :wafer dicing saw
Model :HT-YB
Brand :HT
Application :Industrial
Feature :Durable
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Electroplated bond diamond blades Hub Blade with Hub HT-YB series

The HT-YB series diamond abrasive blade is one specific type of electroplated hub dicing blades we supply. It is a high-end diamond cutting tool designed using advanced technology and imported equipment. The diamond blade is made using an ultra-thin diamond wheel and a high precision aluminum alloy hub in a one-step molding and electroplating process.

This type of electrohub blade – also known as a diamond saw blade with hub — comes with a high cutting efficiency and a stable cutting quality. By adjusting the blade strength, negative results such as an S-shaped cutting and blade damage and be prevented.

For more super abrasives and tools, please continue browsing the web pages or contact us directly.

Features:

1. This dicing blade has a high toughness and precision, an ultra-thin body, a long service life, and is easy to operate.

2. It can carry out difficult bevel cutting and step cutting processes.

3. Blade changing and overall maintenance time has been reduced.

4. The diamond abrasive blade comes with a combination of multi-sized abrasive particles and different binding agents, in order to meet carious processing requirements.

Applications of the Diamond Abrasive Blade

Silicon (Si) wafer, Gallium Arsenide, Gallium Phosphide, and Gallium Arsenide Phosphide

High End Wafer Dicing Saw Gallium Phosphide With Adjustable Blade Strength

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