
Add to Cart
6-12 Inch Round Vacuum Chuck Table , High Flatness Ceramic Metal Chuck Table
Our 6-12 Inch Round Vacuum Chuck Table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding and dicing processes. The back grinding chuck tables and dicing chuck tables work well with Japanese, German and Chinese dicing saws and back grinding machines, thus ensuring an excellent cost effectiveness.
Features | 6-12 Inch Round Vacuum Chuck Table |
1 | high flatness and parallelism |
2 | uniform size and distribution |
3 | object suction |
4 | easy dress |
Applications
6, 8 and 12 inch semiconductor wafers
Applicable Machines
Back grinding machines, dicing saws, DISCO DFD641
Type
Ceramic, Metal