High planarity 8 inch magnetic chuck porous vacuum chuck table fit for DISCO dicing saw
Porous ceramic chuck table is used for supporting and chucking wafer. Hongtuo's chuck table is designed to fit for Japan, German and China made machines.
Specifications size: 2, 3, 4, 5, 6, 8, 12 inch
Supporting machine: grinder for wafer and dicing saw.
Type: Ceramic sucker , metal sucker.
Applicable Machines
dicing saws
Type
Ceramic,Metal
Features:
| 1 | This wafer chuck provides a high flatness and depth of parallelism. |
| 2 | It is compact in structure, uniform size and high strength. |
| 3 | It features a well-distributed absorption capacity. |
| 4 | The dicing accessory is easy to dress. |
Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding and dicing processes. The back grinding chuck tables and dicing chuck tables work well with Japanese, German and Chinese dicing saws and back grinding machines, thus ensuring an excellent cost effectiveness.
Package show:
